Hacked Gadgets Forum

January 22, 2013

How to Build a Tiny Surveillance Spy Bug

at 11:25 pm. Filed under Cool Gadgets, Electronic Hacks


Dazaro3 shows us how to make a Tiny Surveillance Spy Bug in this video.  Dazaro3 makes the PCB using the toner transfer method. Since the board is very small (9mm X 9mm) and the parts and even smaller assembling the thing looks very difficult!  The result is a super small device though.

“Parts used:

Home made PCB ,9mm X 9mm

SMD 2N3904 transistors x 1
  (All capacitors and resistors are SMT 805)
1nf ceramic capacitor x 1
10pf ceramic capacitor x 2
33pf ceramic capacitor x 1
22nf axial ceramic capacitor x 1
1 – 5p to 30p air trimmer
100R resistor
5.6K resistor
3mm Mic
165cm antenna
CR2032Battery holder”


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6 Responses to “How to Build a Tiny Surveillance Spy Bug”

  1. Parmin Says:

    The schematic looks like from Talking Electronics.

    I think if using CR2032 battery, the board might as well be made to 20mm diameter and using the extra space to etch the coil into.
    Even though the Q factor of the coil will be less, the whole thing can be much thinner, thus easier to “tuck” in to places 😀

  2. Berni Says:

    Don’t think i ever seen someone solder SMD parts while holding them with the finger, should really invest in some fine tweezers

  3. Joe Says:

    “1 – 5p to 30p air trimmer”

    Which does that mean?
    1) Quantity 1: 5p to 30p air trimmer
    2) Any air trimmer with a lower limit of 1p and an upper limit anywhere from 5p to 30p
    3) Any air trimmer with a lower limit anywhere from 1p to 5p and an upper limit of 30p

  4. Parmin Says:


    Any air trimmer with a lower limit anywhere from 1p to 5p and an upper limit of 30p

  5. MrMaigo Says:

    As small as I gets with out the government having them built?

  6. George Johnson Says:

    Should make the board larger, for assembly, then cut it down to size. Maybe just along one axis, one side, just something to clip on to.

    Plus, don’t “tin” the whole board like that, do it as you solder it. The problem doing this way is the components are stressed, or lopsided.

    If it’s not tinned like that, then the component lays flat on the board. If you have a blob of solder, it sits at a bit of an angle.

    “tin” just one connection, one solder pad. Hold the part with tweezers, then at the same time, heat the pad with the solder, and hold the component on both pads (the unsoldered one, and the one you’re heating), then quickly solder the other pad (so you don’t melt the previous one).

    Good design though. I may make one myself. But I never got that TT method to work. I use MG Chemicals stuff and some transparency.

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