Will this new IBM/3M super adhesive revolutionize the computer CPU as we know it? We have been hearing that the silicon technology in our modern day processors is nearing the edge of size reduction. Just like growing the chip die to add additional CPUs this new idea allows the addition of processors but without the increase of the die footprint by stacking them! One can only imagine how the connections between layers can be aligned with the precision that will be needed.
“Such stacking would allow for dramatically higher levels of integration for information technology and consumer electronics applications. Processors could be tightly packed with memory and networking, for example, into a “brick” of silicon that would create a computer chip 1,000 times faster than today’s fastest microprocessor enabling more powerful smartphones, tablets, computers and gaming devices.
The companies’ work can potentially leapfrog today’s current attempts at stacking chips vertically – known as 3D packaging. The joint research tackles some of the thorniest technical issues underlying the industry’s move to true 3D chip forms. For example, new types of adhesives are needed that can efficiently conduct heat through a densely packed stack of chips and away from heat-sensitive components such as logic circuits. “
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